UV-underfill, red-bonding, epoxy adhesive precision standalone dispenser with dual-dispensing desks
Copyright © 2025 Shenzhen Second Intelligent Equipment Co., Ltd All rights reserved.
Menu
UV-underfill, red-bonding, epoxy adhesive precision standalone dispenser with dual-dispensing desks
Smart high precision automated adhesive material dispensing machine with inline conveying system.
DH Series Cantilever In-Line Automated Dispensing Systems Platforms:
● Large stroke dispensing for large product length and width
● Powerful expansion capabilities for ion cleaning, dispensing, testing UV exposure, etc.
● Powerful feature
● Rich Configuration
● Smart
● Wide range of application
DH Series Inline dispensing machine
● One-piece mineral casting, ultra-high precision and ultra-stability
● Powerful expansion capabilities for ion cleaning, dispensing, testing, UV exposure, etc.
● Extensible
● Powerful feature
● Rich Configuration
● smart
● Wide range of application
Rich product variety:
Stand-alone platforms, gantry in-line platforms, cantilever in-line platforms
Diversified application processes and modules:
From 5ML to 200L packaging glue, from various needle rotary dispensing to various
product rotary dispensing, from simple syringe dispensing to metering dispensing and non-contact jet dispensing.
Powerful system features:
From three-axis applications to five-axis applications, from simple automatic needle alignment to
complex 3D scanning and path guidance
Floor-standing platform performance:
● CCD visual programming precise positioning, visual correction, improve programming efficiency and dispensing accuracy;
● Chinese and English operating system, clear software interface layout, simple operation, easy to learn and understand;
● Support visual inspection, integrated control of dispensing and visual inspection, one machine for multiple uses, effectively control dispensing yield;
● Can be equipped with a line laser scanner for 3D path guidance to achieve flexible dispensing;
● The software can support a variety of dispensing systems and functional module applications, such as automatic needle alignment, automatic height measurement, dispensing weighing compensation, five-axis linkage and other functions,
effectively overcome the difficulties of various dispensing processes and help improve dispensing quality;
This machine is suitable for UV-packaging, hot melt adhesive dispensing robot bonding, epoxy bottom filling (underfill) and other precision dispensing processes.
This machine is used in solder paste dispensing, semiconductor IC packaging, bottom filling and other processes.
With this steup, in one machine, it can provide multiple functions, such as plasma treatment before dispensing; or UV curing after dispensing. It is suitable for high capacity UPH production, one operator can handle two stations efficiently and effectively.